?

Test Capability

Your current position:Home|Products|Test Capability

 
Semiconductor ICs are increasingly becoming denser with more functionality resulting in a more complex test environment, requiring more advanced test systems and capabilities. TFME provides a complete range of semiconductor testing services including wafer probe, strip testing, final testing and system level testing.
 
TFME provide customers with a full range of test platforms and engineering services to support a wide range of analog and mixed signal, automotive, Radio Frequency (RF), high-performance digital semiconductor devices, baseband and application specific integrated circuits. With the additional of TF-AMD, our test portfolio includes, CPU, GPU, gaming console and high performance networking products.
 
Our full turnkey solutions designed to be faster time to market, which include wafer bump services, probe, final test and post-test services delivering the lowest cost of test to our customers and faster time-to-market.
 
TFME advanced probe and inspection services supports known good die (KGD) binning, thin wafers, high volume devices with both soft dock and direct docking for sensitive devices.  



Available test platforms:

TFME utilizes MES system integrated with testers on the shop floor to enable real time yield analysis and performance monitoring to improve efficiencies with the goal of achieving highest 1st pass yield.



?

CopyRight 2015 All Right Reserved Tongfu Microelectronics Co., Ltd.
Address: Jiangsu province Nantong City Road, No. 288 Telephone:0513-85058888 Fax:0513-85058868

福利彩票双色球坐标走势图 重庆欢乐生肖微信群机器人 天津快乐10分 牛天王中心棋牌 福建快三助手 女生做什么副业赚钱 优乐精江西抚州麻将 如何用自己的私家车赚钱 上下分麻将平台是赌博 滚球指数即时指数 凡乐湖北麻将官网 全世界篮球比分网 大乐透篮球最大的数是几 pk10计划软件免费手机版 云南十一选五 113cc彩票下载 工人零碎时间赚钱